During the casting process, the heating and cooling of the thermal cycle causes the mold to shrink. The thermal stress of the compression. The very fine crack on the surface of the mold that occurs due to this thermal stress is called a plaque, and this crack is written on the product, called a plaque. The plaid marks are caused by improper casting conditions, improper mold material and strength, hardness, improper mold cooling such as external Kosala malili, mpe lokola.
Ba contre-mesures .
* Kokitisa bokeseni kati na molunge ya moule mpe ya supu mpe kokitisa choc thermique.
* Chauffer moule liboso ya kobwaka.
* Kolendisama ya malili ya kati mpe kolongola malili ya libanda.
*Matériel ya molde. Traitement ya chaleur esengeli ezala oyo ebongi mingi pona kobongisa makasi pe makasi.
* Esengeli konika molangi mobimba mpo na kokitisa bilembo ya mbeli mpe kolata bilembo.
Ndimbola
Perle ya métal sphérique oyo esalemi na bord ya matériel oyo e causer die to na coin to na surface ya suka. composition chimique ezali ndenge ya séparation inverse soki tokokanisi yango na moyenne ya composition (composition métallique).
Ntina na yango .
Surface ya moule ekiti mpo na rétrécissement ya bord to eteni ya coin, couche ya surface ya matériaux ya die-casting e solidifié malembe malembe, mpe solution ya solute ya kati ezali concentré en raison ya pressurisation, etc., mpe eteni ya void ya moule mpe produit die oyo esalemi na se ya rétrécissement ya solidification ya moke{3}} connation ya moke*rekretion ya reversein} concret ya solidification{3}} connateur ya moke ya{3} REVERSIF} Bokabwani esalemi.
*Kotombola malili ya ba coins ya ba bords.
* Kokitisa molunge ya supu. .
* Kokitisa pression ya coulée mpe ko optimiser temps ya pressurisation.
*Poná lolenge ya alliage (alliage oyo ezali na mwa esika ya boyokani ya makasi-liquide).
